1 mechanical key switch (smd) B3S surface-mounted device (smd) design meets high-density mounting requirements the whole switch body can be washed after soldering due to its sealing property. sealed construction provides high reliability in dusty environments. available with ground terminal for protection against static electricity. positive tactile feedback. fully sealed. ordering information 6 6-mm-type B3S-1000 series operating force (of) w ithout ground terminal w ith ground terminal pg () bags embossed tape (see note) bags embossed tape (see note) general-purpose 1.57 n (160 gf) B3S-1000 B3S-1000p B3S-1100 B3S-1100p high-force 2.25 n (230 gf) B3S-1002 B3S-1002p B3S-1102 B3S-1102p note: switches on embossed tape must be ordered in units of 1,000. specifications ratings/characteristics switching capacity 5 to 24 vdc, 1 to 30 ma (resistive load) insulation voltage 30 vdc contact configuration spst-no contact resistance 100 m w max. (initial value) (rated 5 vdc, 1 ma) insulation resistance 100 m w min. (at 250 vdc) dielectric strength 500 v ac, 50/60 hz for 1 min bounce time 5 ms max. v ibration resistance malfunction: 10 to 55 hz, 1.5-mm double amplitude shock resistance destruction: 1,000 m/s 2 min. (approx. 100g min.) malfunction: 100 m/s 2 min. (approx. 10g min.) life expectancy general-purpose models: 500,000 operations min. high-force models: 300,000 operations min. ambient temperature operating: 25 c to 70 c (with no icing) ambient humidity operating: 35% to 85% weight approx. 0.30 g
B3S B3S 2 operating characteristics item B3S-1000 series general-purpose models high-force models operating force (of max.) 1.57 n (160 gf) max. 2.25 n (230 gf) max. reset force (rf min.) 0.2 n (20 gf) min. 0.49 n (50 gf) min. pretravel (pt) 0.25 +0.2 / 0.1 mm
B3S B3S 3 engineering data operating force vs. stroke (typical) stroke s (mm) operating force (gf) high-force models general-purpose models nomenclature cover plunger moving contact (disk spring) fixed contact base spacer sealing rubber
B3S B3S 4 dimensions note: all units are in millimeters unless otherwise indicated. without ground terminal B3S-1000 B3S-1002 with ground terminal B3S-1100 B3S-1102 pcb mounting (t op v iew) t erminal arrangement /internal connections (t op v iew) pcb mounting (t op v iew) t erminal arrangement /internal connections (t op v iew) 3.3 dia. 3.3 dia. precautions reflow soldering attach a thermocouple to one side of the terminal with high-temper - ature solder and use the thermocouple to set the reflow oven to a peak terminal temperature of 230 5 c. the optimum heating curve is shown below . note: the above heating curve applies if the thickness of the circuit board is 1.6 mm. 30 s max. time (s) 60 to 90 s 20 s normal temperature 1 to 4 c/s 1 to 5 c/s t emperature ( c) % 10 s max. do not apply additional force to the plunger once it has stopped moving. do not repeatedly press the plunger off-center or from an acute angle. B3S switches are designed to allow submersed washing after sol - dering. when washing, follow the guidelines given below: 1. clean with alcohol solvents. do not use chlorine solvents or water. 2. when using ultrasonic cleaning in two- or three-tank systems and do not clean for more than one minute at a time or for more than three minutes total. 3. do not apply external force to the switch while washing. 4. do not wash immediately after soldering. if possible, allow components to stand for at least three minutes before washing. 5. the switch cannot be used where subject to direct contact with water .
B3S B3S 5 key switch packing key switches are packed on tape as shown below . top tape material: pet carrier tape (material: ps+butadiene) tape reel label 330 dia. 13 dia. 21.5 tape drawing direction 1.5 dia. +0.1 / 0 pitch: 12 0.1 pitch: 4 0.1 2 1.5 9.4 0.06 0.4 4.7 8.7 7 7.5 1.75 16 standard conforms to eiaj standards package 1,000 key switches heat resistance 60 c for 24 hours (without deformation) note: the ground terminals of the key switches are on the guide- hole side of the package. all dimensions shown are in millimeters. to convert millimeters into inches, multiply by 0.03937. t o convert grams into ounces, multiply by 0.03527. cat. no. c108-e1-1 omron corporation control components division h.q. 28th fl., crystal t ower bldg. 1-2-27, shiromi, chuo-ku, osaka 540 japan phone: 06-949-61 15 fax: 06-949-6134 all dimensions shown are in millimeters. to convert millimeters into inches, multiply by 0.03937. t o convert grams into ounces, multiply by 0.03527. in the interest of product improvement, specifications are subject to change without notice. printed in japan 0697-1m (0697) a
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